We are currently looking for a Staff Equipment Engineer (Die Bond) for one of the leading semiconductor manufacturers based in Malaysia. This position requires your urgent attention.
- Reporting to: Head of Department
- Location: Melaka
- Excellent remuneration and benefits package
the role
- Develop and implement a comprehensive planned maintenance program for Die Bond equipment, ensuring optimal performance, high availability, and reliability.
- Lead teams in executing scheduled maintenance tasks efficiently and comprehensively. Define optimal parts lifespan and consumption patterns to minimize waste.
- Cultivate a culture of equipment improvement through training, proactive troubleshooting, and root cause analysis. Implement Advanced Process Control for better control and optimization.
- Develop and implement a framework for equipment governance. Manage maintenance costs while maximizing equipment performance.
- Collaborate with other departments to qualify new equipment and develop technician skills according to defined competency models..
the experience
- Bachelor's or Master's degree in Engineering (relevant field) or equivalent experience.
- 5+ years of relevant experience in electronics or semiconductor manufacturing.
- Proven ability to build and lead high-performing maintenance teams.
- Broad knowledge of mechanical engineering and manufacturing processes. Familiarity with cutting-edge equipment and technologies.
- Energetic, dynamic, proactive, and results-oriented with strong analytical skills and a commitment to continuous improvement.
how to apply
To apply online, please use the relevant link provided. Only shortlisted candidates will be contacted by Michelle.
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