Job opening - RDL/uBump Expert in 神奈川 | Randstad

summary

神奈川, 神奈川県
¥8,000,000 - ¥20,000,000 per year, 年収800 ～ 2,000万円
permanent

job category
engineering

job details

社名
社名非公開

職種
製品開発エンジニア

業務内容 ...

Focusing on the 3D die stacking technology developing and research. It is more desirable to have deep experience in both micro bump interconnection technologies of using pre applied underfill NCF (Non-Conductive-Film) and post applying one includng fluxing. Thermal compression bonding skill is mandatory. At least 40 um bump pitch technical experience is required, 20um bump pitch is desirable at the research level. 1. Leading 3D die stacking technology development with material and equipment companies.2. Have enough knowledge about bump interconnection part, and can propose the optimum bump material from the viewpoint of reliability for pitch reduction.3. Have enough knowledge about NCF and flux materials, and can propose material property required to realize fine pitch interconnection and lead material suppliers.4. Have more than 10 years experience in packaging industry like assembly, material and equipment

求められる経験
1. Bachelor’s degree or higher.
2. Proficient in RDL and uBump technology development and research area.
3. With a strong leadership to cooperate with the surrounding multi-synergistic business units. Have personal strong influence in industry.
4. Active thinking, with a strong ability to innovate.

保険
健康保険　厚生年金保険　雇用保険

休日休暇
土曜日　日曜日　祝日

給与
年収800 ～ 2,000万円

賞与
-
雇用期間
期間の定めなし

show more

社名
社名非公開

職種
製品開発エンジニア

業務内容
Focusing on the 3D die stacking technology developing and research. It is more desirable to have deep experience in both micro bump interconnection technologies of using pre applied underfill NCF (Non-Conductive-Film) and post applying one includng fluxing. Thermal compression bonding skill is mandatory. At least 40 um bump pitch technical experience is required, 20um bump pitch is desirable at the research level. 1. Leading 3D die stacking technology development with material and equipment companies.2. Have enough knowledge about bump interconnection part, and can propose the optimum bump material from the viewpoint of reliability for pitch reduction.3. Have enough knowledge about NCF and flux materials, and can propose material property required to realize fine pitch interconnection and lead material suppliers.4. Have more than 10 years experience in packaging industry like assembly, material and equipment

求められる経験
1. Bachelor’s degree or higher.
2. Proficient in RDL and uBump technology development and research area.
3. With a strong leadership to cooperate with the surrounding multi-synergistic business units. Have personal strong influence in industry. ...

show more

experience
1. Bachelor’s degree or higher. 2. Proficient in RDL and uBump technology development and research a

apply with randstad.
Applying with us is easy. We will review your application and see if you are a good fit for the job and the company.
we'll give you a call.
Our consultant will call you at a suitable time to discuss your application and further career aspirations.
getting you registered.
If you’ve never worked with us before, we’ll need some basic additional pieces of information to confirm your eligibility for work.
compliance check.
Next, we just need to verify a few things - we’ll make the relevant compliance checks and keep you posted.
reference and background check.
As part of the process in ensuring you’re perfect for the role, we’ll make contact with any relevant references you’ve provided.
the perfect job for you.
Our expert team will either arrange an interview for the role you’ve applied for, or if they believe there’s a better opportunity, they’ll suggest alternative options too.
the interview.
We’ll ensure that you’re fully prepared ahead of your interview and know exactly what to expect - good luck!
start your new job.
Congratulations, you’re ready to begin your new job. The team will ensure that you’re fully prepared for your first day.

electron beam system expert【大手電機機器メーカー】
- 神奈川, 神奈川県
- permanent
- ¥8,000,000 - ¥20,000,000 per year, 年収800 ～ 2,000万円
社名社名非公開職種回路設計、制御設計業務内容About our Client:Our client is a renowned global technology leader, consistently pushing the boundaries of innovation, particularly in the areas of advanced electronics and system solutions. With a strong presence in Japan, they are dedicated to developing state-of-the-art technology and fostering a collaborative, forward-thinking environment. The company is committed to creating cutting-edge solutions that shape the future of technol
posted 17 september 2024
社名社名非公開職種回路設計、制御設計業務内容About our Client:Our client is a renowned global technology leader, consistently pushing the boundaries of innovation, particularly in the areas of advanced electronics and system solutions. With a strong presence in Japan, they are dedicated to developing state-of-the-art technology and fostering a collaborative, forward-thinking environment. The company is committed to creating cutting-edge solutions that shape the future of technol
show job details
【大手電機機器メーカー】substrate technology expert
- 神奈川, 神奈川県
- permanent
- ¥8,000,000 - ¥20,000,000 per year, 年収800 ～ 2,000万円
社名社名非公開職種プロセスエンジニア, プロセス開発業務内容通信機器および端末(スマートフォン、ウェアラブル等)におけるPCB基板技術の開発ニーズに焦点を合わせ、基板の構成部材およびプロセスにおける重要な技術的チャンスを発掘、識別し、基板サプライヤーまたは二次サプライヤーと協力し技術開発を行う。基板技術力向上をリードし、技術チームを率いて、競争力のある基板技術プラットフォームを構築し、製品のビジネス成功をサポートする。1、通信機器/消費者向け端末等の電子製品分野における基板技術企画および戦略企画をリードし、技術の目指す方向の正確性、持続性、および実用性を確立し、PCBの技術、品質、提供、ライフサイクルおよびコストにおいて業界をリードする競争力を実現する。2、通信機器/コンシューマー端末等の電子製品分野における基板関連の統合的な技術プロジェクトの開発と応用をリードし、重要な問題の解決および技術レビューと意思決定を行う。3、基板プロセス技術の規範/規格/サプライヤー開発をリードし、標準化と技術研究プロジェクト
posted 25 june 2024
社名社名非公開職種プロセスエンジニア, プロセス開発業務内容通信機器および端末(スマートフォン、ウェアラブル等)におけるPCB基板技術の開発ニーズに焦点を合わせ、基板の構成部材およびプロセスにおける重要な技術的チャンスを発掘、識別し、基板サプライヤーまたは二次サプライヤーと協力し技術開発を行う。基板技術力向上をリードし、技術チームを率いて、競争力のある基板技術プラットフォームを構築し、製品のビジネス成功をサポートする。1、通信機器/消費者向け端末等の電子製品分野における基板技術企画および戦略企画をリードし、技術の目指す方向の正確性、持続性、および実用性を確立し、PCBの技術、品質、提供、ライフサイクルおよびコストにおいて業界をリードする競争力を実現する。2、通信機器/コンシューマー端末等の電子製品分野における基板関連の統合的な技術プロジェクトの開発と応用をリードし、重要な問題の解決および技術レビューと意思決定を行う。3、基板プロセス技術の規範/規格/サプライヤー開発をリードし、標準化と技術研究プロジェクト
show job details
【大手電機機器メーカー】underfill/liquid molding compound material expert
- 神奈川, 神奈川県
- permanent
- ¥8,000,000 - ¥20,000,000 per year, 年収800 ～ 2,000万円
社名社名非公開職種マテリアルエンジニア業務内容Focusing on research to fill narrow gaps, such as the development and research of filling techniques for 20um chip-to-chip gaps. It is more desirable to have deep experience in both underfill and liquid molding compound for narrow gap filling, including not only material technologies but also process technologies to fill. Furthermore, it is desirable to have experience in the process technology of compression molding. At least fillin
posted 25 june 2024
社名社名非公開職種マテリアルエンジニア業務内容Focusing on research to fill narrow gaps, such as the development and research of filling techniques for 20um chip-to-chip gaps. It is more desirable to have deep experience in both underfill and liquid molding compound for narrow gap filling, including not only material technologies but also process technologies to fill. Furthermore, it is desirable to have experience in the process technology of compression molding. At least fillin
show job details

Thank you for subscribing to your personalised job alerts.

You need to enable JavaScript to run this app.