We are currently looking for a Process Lead/Process Manager (Wire Bond) for one of the leading semiconductor manufacturers based in Malaysia. This position requires your urgent attention.
- Reporting to: Senior Manager
- Location: Melaka
- Excellent remuneration and benefits package
the role
- Drive continuous improvement in manufacturing processes to ensure timely delivery of products that meet customer specifications for functionality, reliability, volume, and cost.
- Quality Assurance Expertise: Implement and maintain quality control plans, ensuring adherence to key parameters and controls.
- Wire Bonding Specialist: Possess in-depth knowledge of FOL (Front-of-Line) process engineering, particularly in wire bonding.
- Analytical Skills: Demonstrate a strong understanding of key process parameters and their impact on product quality.
- Results-Oriented: Focus on achieving optimal process efficiency and delivering high-quality products on time.
the experience
- Bachelor's degree in a relevant field (Mechanical, Electrical, Electronics, or relevant) with at least 8 years of experience in Front-of-Line (FOL) Process Engineering or Semiconductor Assembly Manufacturing.
- Possess strong analytical and problem-solving skills, including statistical data analysis.
- Demonstrate the ability to anticipate and quickly resolve potential issues and challenges.
- Be an expert in manufacturing processes and possess some equipment knowledge.
- Utilize systematic problem-solving methodologies such as 8D, DMAIC, Process Mapping, FTA, and Fishbone Analysis.
how to apply
To apply online, please use the relevant link provided. Only shortlisted candidates will be contacted by Michelle.
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