¥8,000,000 - ¥20,000,000 per year, 年収800 ~ 2,000万円
社名社名非公開職種製品開発エンジニア業務内容Focusing on the 3D die stacking technology developing and research. It is more desirable to have deep experience in both micro bump interconnection technologies of using pre applied underfill NCF (Non-Conductive-Film) and post applying one includng fluxing. Thermal compression bonding skill is mandatory. At least 40 um bump pitch technical experience is required, 20um bump pitch is desirable at the research level. 1. Leading 3D die s
社名社名非公開職種製品開発エンジニア業務内容Focusing on the 3D die stacking technology developing and research. It is more desirable to have deep experience in both micro bump interconnection technologies of using pre applied underfill NCF (Non-Conductive-Film) and post applying one includng fluxing. Thermal compression bonding skill is mandatory. At least 40 um bump pitch technical experience is required, 20um bump pitch is desirable at the research level. 1. Leading 3D die s
¥8,000,000 - ¥20,000,000 per year, 年収800 ~ 2,000万円
社名社名非公開職種製品開発エンジニア業務内容1. Packaging design for high power semiconductor laser devices.2. Development and optimization of high thermal conductivity bonding process.3. Design and simulation of beam shaping system for high-power semiconductor lasers and the optical coupling.4. Thermal and stress design of multi-channel lasers.5. Test and verification of components performance and reliability.求められる経験1. Bachelor’s degree and above.2. Deep understanding of GaAs-b
社名社名非公開職種製品開発エンジニア業務内容1. Packaging design for high power semiconductor laser devices.2. Development and optimization of high thermal conductivity bonding process.3. Design and simulation of beam shaping system for high-power semiconductor lasers and the optical coupling.4. Thermal and stress design of multi-channel lasers.5. Test and verification of components performance and reliability.求められる経験1. Bachelor’s degree and above.2. Deep understanding of GaAs-b
¥8,000,000 - ¥20,000,000 per year, 年収800 ~ 2,000万円
社名社名非公開職種フィールドサービスエンジニア業務内容Responsibility1. Provide product technical support, including consulting , training, onsite technical guidance, fault analysis, and troubleshooting.2. Communicate with the R&D department and provide information feedback, participate in technical training and workshops.3. Collect customer feedback, develop market requirements, report them to R&D, and track their progress.4. Assist sales department in promoting the company's produc
社名社名非公開職種フィールドサービスエンジニア業務内容Responsibility1. Provide product technical support, including consulting , training, onsite technical guidance, fault analysis, and troubleshooting.2. Communicate with the R&D department and provide information feedback, participate in technical training and workshops.3. Collect customer feedback, develop market requirements, report them to R&D, and track their progress.4. Assist sales department in promoting the company's produc
¥8,000,000 - ¥20,000,000 per year, 年収800 ~ 2,000万円
社名社名非公開職種製品開発エンジニア業務内容Responsibility:Our research center is looking for a reputable researcher in the area of 6G wireless telecommunication for Korea. The successful candidate has responsible for researches on Beyond5G/6G technology through academia collaboration, industry ecosystem management in Korea (including wireless standard organizations in Korea ) and conducting own research subjects, such as AI/ML application for 6G wireless system to meet corpora
社名社名非公開職種製品開発エンジニア業務内容Responsibility:Our research center is looking for a reputable researcher in the area of 6G wireless telecommunication for Korea. The successful candidate has responsible for researches on Beyond5G/6G technology through academia collaboration, industry ecosystem management in Korea (including wireless standard organizations in Korea ) and conducting own research subjects, such as AI/ML application for 6G wireless system to meet corpora
¥8,000,000 - ¥20,000,000 per year, 年収800 ~ 2,000万円
社名社名非公開職種回路設計、制御設計業務内容About our Client:Our client is a renowned global technology leader, consistently pushing the boundaries of innovation, particularly in the areas of advanced electronics and system solutions. With a strong presence in Japan, they are dedicated to developing state-of-the-art technology and fostering a collaborative, forward-thinking environment. The company is committed to creating cutting-edge solutions that shape the future of technol
社名社名非公開職種回路設計、制御設計業務内容About our Client:Our client is a renowned global technology leader, consistently pushing the boundaries of innovation, particularly in the areas of advanced electronics and system solutions. With a strong presence in Japan, they are dedicated to developing state-of-the-art technology and fostering a collaborative, forward-thinking environment. The company is committed to creating cutting-edge solutions that shape the future of technol