社名
社名非公開
職種
マテリアルエンジニア
業務内容
...
Focusing on research to fill narrow gaps, such as the development and research of filling techniques for 20um chip-to-chip gaps. It is more desirable to have deep experience in both underfill and liquid molding compound for narrow gap filling, including not only material technologies but also process technologies to fill. Furthermore, it is desirable to have experience in the process technology of compression molding. At least filling for 40 um gap technical experience is required, 20um gap is desirable at the research level. 1. Leading narrow gap filling technologies development with material and equipment companies.2. Have enough knowledge about underfill and liquid molding compound, and can propose the optimum material property from the viewpoint of void-less filling and reliability. Especially large size chip with narrow gap.3. Have enough knowledge about filling process technologies including capillary dispense process and compression molding.Have more than 10 years experience in packaging industry like assembly, material and equipment.
求められる経験
1. Bachelor’s degree or higher.
2. Proficient in underfill and liquid molding compound development and research area.
3. With a strong leadership to cooperate with the surrounding multi-synergistic business units.
4. Have personal strong influence in industry.
5. Active thinking, with a strong ability to innovate.
保険
健康保険 厚生年金保険 雇用保険
休日休暇
土曜日 日曜日 祝日
給与
年収800 ~ 2,000万円
賞与
-
雇用期間
期間の定めなし
show more
社名
社名非公開
職種
マテリアルエンジニア
業務内容
Focusing on research to fill narrow gaps, such as the development and research of filling techniques for 20um chip-to-chip gaps. It is more desirable to have deep experience in both underfill and liquid molding compound for narrow gap filling, including not only material technologies but also process technologies to fill. Furthermore, it is desirable to have experience in the process technology of compression molding. At least filling for 40 um gap technical experience is required, 20um gap is desirable at the research level. 1. Leading narrow gap filling technologies development with material and equipment companies.2. Have enough knowledge about underfill and liquid molding compound, and can propose the optimum material property from the viewpoint of void-less filling and reliability. Especially large size chip with narrow gap.3. Have enough knowledge about filling process technologies including capillary dispense process and compression molding.Have more than 10 years experience in packaging industry like assembly, material and equipment.
求められる経験
1. Bachelor’s degree or higher.
...
2. Proficient in underfill and liquid molding compound development and research area.
3. With a strong leadership to cooperate with the surrounding multi-synergistic business units.
4. Have personal strong influence in industry.
5. Active thinking, with a strong ability to innovate.
保険
健康保険 厚生年金保険 雇用保険
休日休暇
土曜日 日曜日 祝日
給与
年収800 ~ 2,000万円
賞与
-
雇用期間
期間の定めなし
show more