Job opening - 3D stacking tachnology Expert in 神奈川 | Randstad

summary

神奈川, 神奈川県
¥8,000,000 - ¥20,000,000 per year, 年収800 ～ 2,000万円
permanent

job category
engineering

job details

社名
社名非公開

職種
製品開発エンジニア

業務内容 ...

Focusing on the FO-WLP/PLP technology developing and research. It is more desirable to have in-depth experience in RDL (redistribution layer) and uBump process and material technologies.For RDL, at least 5/5um line and space technical experience is required, 3/3um line and space 20um is desirable at the research level.For uBump, at least 40um pitch technical experience is required, 20um pitch is desirable at the research level.1. Leading RDL/uBump technology development with material and equipment companies.2. Have enough knowledge about photosensitive polyimide, photoresist, plating liquid and seed etching materials. Able to propose material property required to realize pitch reduction and lead material suppliers.3. Have enough knowledge about photolithography and lead equipment suppliers.4. Have more than 10 years experience in semiconductor industry like IDM, foundry, OSAT, material and equipment supplier.

求められる経験
1. Bachelor’s degree or higher.
2. Proficient in 3D die stacking technology development and research area.
3. With a strong leadership to cooperate with the surrounding multi-synergistic business units.
4. Have personal strong influence in industry.
5. Active thinking, with a strong ability to innovate

保険
健康保険　厚生年金保険　雇用保険

休日休暇
土曜日　日曜日　祝日

給与
年収800 ～ 2,000万円

賞与
-
雇用期間
期間の定めなし

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社名
社名非公開

職種
製品開発エンジニア

業務内容
Focusing on the FO-WLP/PLP technology developing and research. It is more desirable to have in-depth experience in RDL (redistribution layer) and uBump process and material technologies.For RDL, at least 5/5um line and space technical experience is required, 3/3um line and space 20um is desirable at the research level.For uBump, at least 40um pitch technical experience is required, 20um pitch is desirable at the research level.1. Leading RDL/uBump technology development with material and equipment companies.2. Have enough knowledge about photosensitive polyimide, photoresist, plating liquid and seed etching materials. Able to propose material property required to realize pitch reduction and lead material suppliers.3. Have enough knowledge about photolithography and lead equipment suppliers.4. Have more than 10 years experience in semiconductor industry like IDM, foundry, OSAT, material and equipment supplier.

求められる経験
1. Bachelor’s degree or higher.
2. Proficient in 3D die stacking technology development and research area.
3. With a strong leadership to cooperate with the surrounding multi-synergistic business units. ...

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experience
1. Bachelor’s degree or higher. 2. Proficient in 3D die stacking technology development and research

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